Handbook of Wafer Bonding
Peter Ramm, James Jian-Qiang Lu, Maaike M. V. Taklo
Written by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.
In the first part, researchers from companies and institutions around the world discuss the most reliable and reproducible technologies for the production of bonded wafers. The second part is devoted to current and emerging applications, including microresonators, biosensors and precise measuring devices.
In the first part, researchers from companies and institutions around the world discuss the most reliable and reproducible technologies for the production of bonded wafers. The second part is devoted to current and emerging applications, including microresonators, biosensors and precise measuring devices.
類別:
年:
2012
出版商:
Wiley-VCH
語言:
english
頁數:
415
ISBN 10:
3527644229
ISBN 13:
9783527644223
文件:
PDF, 6.64 MB
IPFS:
,
english, 2012